Rise One

Semiconductor facilities for back-end process

besi

Besi is a manufacturer of semiconductor production equipment after the step , which boasts a top-class market share worldwide.

Datacon

2200EVO Plus

Datacon 2200EVO Plus

The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.

8800Quantum Sigma

Datacon 8800 FC Quantum Sigma

The Datacon 8800 FC QUANTUM sigma flip chip bonder represents the next generation of the high-volume, high-accuracy 8800 platform. Beside the factory-proven QUANTUM values it provides superior speed and accuracy while drastically improving your cost-of-ownership.

DS9000e

Datacon DS900e

The Datacon DS9000e is a high speed fully automatic die sorter with output to a frame or carrier. It handles any wafer sizes up to 300 mm and can therefore reconstruct wafers to different output form factors. This enables the transition to larger wafer formats without having to reinvest in downstream packaging equipment. Besides wafers, the DS9000e handle a variety of chip carriers such as waffle pack, JEDEC tray, and Gel-Pak®. The DS9000e offers the ultimate combination of performance, flexibility, and versatility, handling the most challenging die sorting applications.

CS1250

Datacon CS1250

Sort to Tape Reel at up to 16,500 UPH - The high speed Datacon die sorter CS1250 processes WLP and other flipped devices into tape and reel.

  • Pick, flip and place devices from wafer to tape reel with 4 point vision inspection process
  • Capable of handling devices from 0.3 mm up to 10 mm
  • Wafers up to 300 mm diameter

Esec

2009SSIE

Esec 2009SSIE

The new Esec Die Bonder 2009 SSIE is engineered to meet all upcoming challenges in power die attach. Its unprecedented productivity and process control are unmatched in the industry. Thanks to the patented soft solder process technologies the Esec Die Bonder 2009 SSIE ensures your leading market position. The 2009 SSIE is the only softsolder bonder in the market able to handle 300mm / 12" wafers (optional).

2100xP plus

Esec 2100xP plus

The Die Bonder Esec 2100 xPlus is the the 2nd generation of the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award.

2100sD PPPplus

2100sD PPPplus

The Esec 2100 sD PPPplus is the only real Two-in-One Die Bonder on the market. Its instant switching capability between parallel and standard production mode guarantees to produce always highest quality at lowest cost per die placement. Special handling and operating aspects of stacked die are incorporated in the revolutionary machine concept. Further redefining Stacked Die Bonding. For your benefit.

2100hS

2100hS

The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. At its introduction, this innovative platform concept won the prestigious Swiss Technology Award.

Fico

Fico Compact Line

FCL

The Fico Compact Line™ (FCL) puts your manufacturing processes at the edge of today’s technology. The cost/performance ratio of the FCL is unsurpassed in the industry. The FCL processes both, leadless packages and packages with leads. Your investment in a Fico Compact Line™ can result in savings of up to $100,000 per year per system on wear parts alone. With these savings you may consider to replace your current Dambar and Dejunk Cutting systems with Fico Compact Lines. Challenge us with your current cost levels so we can calculate the pay back time in your situation.

Fico Compact Line-X

FCL-X

The new Fico Compact Line - X (FCL-X) is the latest development in Trimming & Forming and processes extreme high density leadframes up to 125 x 300 mm. The advanced pollution control system of the FCL-X allows trouble free processing of preplated and interdigit leadframes. Each press has dedicated aspiration, with controlled high air flow speeds and a unique cyclone dust filter. Short and controlled transport distances increase the performance of the FCL-X and at the same time prevent damage to your products.。


Fico SwingLine

FSL

With the launch of its new flagship Fico Sawing Line (FSL), Besi initiates the new era in singulation. The FSL is the only integrated singulation system on the market of a single solution provider. Full parallel sawing and sorting processes, generate the highest output possible, at lowest cost of ownership. Having already proven its unique and innovative capabilities in the field, the FSL sets out to conquer the industry.

AMS-W

AMS-W

The Fico AMS-W is the most economic and flexible MAP molding system, dedicated to the latest trend in single sided packaging. It is the molding solution for products like QFN, BGA, BOC and BGA-MAP, including high end applications such as flip chip, multi-chip array and stacked die.

Meco

CPL

CPL

Meco CPL: More Power Out of Your Cell at a Lower Cost! The Meco CPL is based on the robust and proven concept of the Meco EPL which has, with more than 350 machines installed worldwide, built a reputation in the semiconductor world for leadframe plating applications.

EPL

EPL

With an installed base of over 350 EDF/EPL systems, Meco has set the industry standard for leadframe solder plating. The system is fully customized to your specific needs and is a green solution, with low power consumption and minimal chemical usage.
The Meco Electro DeFlash and Electro Plating Line are designed for the future and are capable of handling any kind of leadframe product. Any leadframe size up to 110 x 315 mm can easily be handled on the Meco EDF/EPL.

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Inquiries about products please contact RiseOne .
We propose the best equipment , depending on the application and budget .

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