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Automatic Semiconductor Wafer Transfer Mechanism
【Machine Name】 Automatic Semiconductor Wafer Transfer Mechanism 【Overview】 A system that automatically supplies semiconductor wafers to an inspection machine. It takes wafers out of the carrier, corrects their position through pre-alignment, and feeds them to the inspection unit. After inspection, wafers are automatically unloaded and returned to their original positions in the carrier. A vibration isolation mechanism prevents vibration during inspection. 【Specifications & Fe
jpriseone
Sep 30


Automatic Feeder for Ultrasonic Inspection Machines
【Machine Name】 Automatic Feeder for Ultrasonic Inspection Machines 【Overview】 A system that transfers cases loaded with inspection items, feeds them into an ultrasonic flaw detection unit, and carries the cases out after data collection and report output. ◇ Automatically transfers cases loaded with products. ◇ Reads lot information from QR codes, feeds products into the ultrasonic flaw detector, and inputs/outputs image analysis data. ◇ After inspection, blows off moisture wi
jpriseone
Sep 30


PETRA Nanoimprint Stepper
【Machine Name】 Nanoimprint Stepper 【Overview】 A system built by RISE ONE under the supervision of AIST (Tsukuba). It transfers the pattern of a finely engraved mold in a single step. A key feature of this system is its ability to keep the residual layer thin after transfer. 【Specifications & Features】 - Mechanisms & Functions - ■ Nanoimprint unit [mold table] with α/β mold adjustment mechanism ■ High-precision XYθ wafer stage ■ Wafer bending mechanism and XY stage ■ Alignment
jpriseone
Sep 30


Imprint System
A system built by RISE ONE under the supervision of AIST (Tsukuba) and the Minimal Fab Development Association. 【Machine Name】 Imprint System 【Overview】 A system built by RISE ONE under the supervision of AIST (Tsukuba) and the Minimal Fab Development Association. 【Specifications & Features】 ■ Target workpiece material: Silicon, GaAs ■ Size: Min. φ12.5 mm, Max. φ100 mm ■ Fixing method: Mechanical clamping with holding parts ■ Replica mold material: PDMS / thermoplastic resin
jpriseone
Sep 30


Minimal Mask Aligner
A system built by RISE ONE under the supervision of AIST (Tsukuba) and the Minimal Fab Development Association. 【Machine Name】 Minimal Mask Aligner 【Overview】 A system built by RISE ONE under the supervision of AIST (Tsukuba) and the Minimal Fab Development Association. 【Specifications & Features】 ■ 5-megapixel camera optics for front and back alignment marks ■ 2-megapixel camera optics for orientation flat detection ■ XYZ alignment axis resolution: 0.1 µm ■ θ-axis resolution
jpriseone
Sep 30


Roller-Press Imprint System
A system for UV imprinting from large-area molds onto glass substrates. 【Machine Name】 Roller-Press Imprint System 【Overview】 A system for UV imprinting from large-area molds onto glass substrates. 【Specifications & Features】 ■ Automatic inkjet application of UV resin ■ Roller-press method using a transfer roller; transfer speed 0.1–50.0 mm/s ■ Grade 00 granite surface plate for flatness, 500 × 500 mm ■ Compatible mold size: 450 × 450 mm ■ UV light source (LED): 375 nm wavele
jpriseone
Sep 30


IC Height Inspection System Type 2
A system that measures the height of ICs in automatically loaded JEDEC trays. NG units are automatically ejected after measurement. 【Machine Name】 IC Height Inspection System Type 2 【Overview】 A system that measures the height of ICs stored in automatically loaded JEDEC trays. NG units are automatically ejected after measurement. 【Specifications & Features】 ■ Equipped with two KEYENCE WI-010 3D displacement sensors ■ Measurement time: 0.35 s per tray ■ Tray changeover within
jpriseone
Sep 30


IC Height Inspection System Type 1
A system that measures the height of ICs in lead frames loaded automatically or manually. 【Machine Name】 IC Height Inspection System Type 1 【Overview】 A system that measures the height of ICs in lead frames loaded automatically or manually. 【Specifications & Features】 ■ Measures within a 10 mm field of view and up to 0.7 mm in height ■ Up to 99 registered recipes ■ X/Y-axis minimum movement resolution: 1 µm ■ Max stroke: X-axis 300 mm, Y-axis 100 mm
jpriseone
Sep 30
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